Low Pressure Molding (Bild: Henkel)
LPM enables rapid over-forming of sensitive components using polyamide-based hot-melt adhesives combined with appropriate processing equipment and cost-effective injection molding tools. Technomelt products are not abrasive and are injected with significantly lower pressure than traditional injection moulding. This reduces the risk of damaging sensitive components during the LPM process.
This technology is particularly suitable for protecting sensitive components such as circuit boards or jumper cable connections. Hot melt adhesives are strong and flexible at the same time. The material provides a high level of electrical insulation and resistance to a wide range of chemicals, temperature cycles, and vibrations. The components are thus completely protected from external influences such as penetration of water or dust as well as exposure to long-range UV rays.
The products meet the European RoHS Directive (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) regulations and are largely biologically based. Up to 80% is made from renewable plant sources.
For some medical applications, Technomelt can also be used in areas beyond the protection of electronic components. For example, it is suitable for connecting flexible hoses for fluid supply, since it does not twist the hoses and provides a permanently closed connection. Henkel Loctite PA 6951 was developed specifically for this purpose. The product has been tested according to Henkel guidelines, which are based on ISO 10993, the series of biocompatibility standards.
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